Depaneling
Separate with precision
Our depaneling machines separate your printed circuit boards precisely, safely and quickly from the PCB blank - regardless of material, size or contour.
With proven technology and decades of know-how, we perform depaneling both in our integrated assembly lines and, if required, in stand-alone operation. We supply tailor-made automation solutions that are perfectly adapted to your requirements and production.
For depaneling, we rely on the proven processes: Sawing and milling, also in combination. Our depaneling system High-Flex separates your printed circuit board blanks by means of a milling system. Thanks to an innovative gripper system, depaneling of small and medium series is fast and cost-effective.
The depaneling system High-Volume offers the option to use a sawing and/or milling module as required. High production volumes can thus be processed quickly and efficiently.
We offer you the optimum depaneling solution and your very own process automation for all PCBs and requirements.
Depaneling
Variant-independent
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Example system
High-volume
automatic depaneling machine
fast - precise - powerful.
The highly efficient High-Volume depaneler separates your PCB blanks quickly, efficiently and precisely. It is the ideal tool for processing high product volumes. The High-Volume depaneler allows the use of two or more tools (saw and/or milling module) simultaneously!
Shorter throughput times and higher productivity - no problem with the High-Volume depaneler.
Example system
High-flex
automatic depaneling machine
flexible - reliable - cost-efficient.
The flexible depanelling system High-Flex, for depanelling printed circuit boards by means of end mills, offers you the flexibility you need for a large number of variants or for the production of small and medium-sized series.
Thanks to the innovative concept of the High-Flex, PCB blanks are separated quickly, with low stress and precisely. The depaneling is done by a milling system using an end mill, so that any contours can be separated.
Thanks to simple tools and a fully automatic setup change, a large product mix can be separated economically.
To be able to process product variants, no complex and expensive change parts are required - the right gripper is enough! In this way, you keep the costs for change parts as low as possible with the High-Flex!
![[Translate to English:]](/fileadmin/_processed_/a/7/csm_04_Andreas_Benzenh%C3%B6fer_klein_335baa5975.jpg "[Translate to English:]")
When automating PCB depaneling, the choice of the appropriate process depends on factors such as PCB geometry, material, production volume, cycle time, and quality requirements.
Common processes include milling, sawing, laser depaneling, and mechanical methods such as punching, rotary knives, or guillotine cutting. Mechanical processes can be used for simple applications, but they often subject the PCB to higher mechanical stress.
Milling offers a high degree of flexibility and is particularly suitable for complex contours, different product variants, and precise separation tasks. Sawing is an economical solution, especially for straight separation lines and high production volumes. Laser depaneling enables contactless, highly precise processing with low mechanical stress. However, this process requires consideration of thermal impact, possible smoke residue or deposits, as well as the often lower cost-effectiveness compared with milling and sawing for high production volumes.
The optimal solution depends on the specific application. In addition to the separation process, handling, process integration, and integration into downstream inspection and sorting processes also play a crucial role.
Pematech relies on proven milling and sawing processes for automated depaneling, as they provide high precision, low mechanical stress, and cost-effective processing for both flexible product variants and high production volumes. Our depaneling solutions are individually tailored to the product, cycle time, and production requirements – from stand-alone systems to fully integrated solutions within automated inspection and assembly lines.
The development of a depaneling system at Pematech does not start with the machine, but with the product and the entire manufacturing process. Key factors include the properties of the PCB panel, separation contours, the sensitivity of the assembly, the required cycle time, and the subsequent process steps.
Based on these requirements, the appropriate separation concept is developed. Pematech relies on milling and sawing solutions that enable precise separation with low mechanical stress. Depending on the application, suitable workholding and gripper systems, tooling concepts, and process monitoring are designed to ensure reliable processing of different PCB variants.
A particular focus is placed on integration into the entire production chain. Depaneling is not considered in isolation but is coordinated with functions such as handling, sorting, inspection, barcode scanning, and traceability. This creates continuous processes with high transparency and reproducible quality.
Automated depaneling is particularly cost-effective when PCBs are regularly produced in larger quantities, short cycle times are required, or consistently high process quality is essential. While manual depaneling processes depend heavily on the operator’s experience and care, an automated solution ensures consistent process parameters and reproducible results.
Automation offers particular advantages for sensitive PCBs, complex geometries, or demanding quality requirements. Cutting forces, positioning, and process sequences can be specifically monitored and optimized, reducing the risk of damage, microcracks, or scrap.
Automated depaneling can also be economically viable for frequently changing products if intelligent setup concepts and flexible programming enable fast product changeovers. In addition, inspection, handling, and marking processes can be integrated directly, creating a continuous automated production process.
Pematech develops customized solutions for the automated depaneling of PCBs and electronic assemblies, tailored to the product, material, cycle time, and quality requirements. The depaneling process, handling, and integration into existing or new production lines are considered as a complete solution.