Precise, fast and with sensitivity
Parts handling and logistics for DBC substrates | ceramic circuit boards
Direct Copper Bonding Substrates (also known as DCB, DDC, DBC or ceramic substrates) have long been a proven standard for power electronics modules in industry, automotive applications and household appliances due to their excellent thermal conductivity.
As a general contractor, Pematech offers complete systems (CE-certified) with customized parts handling and logistics, as well as the integration of processes such as solder paste printing, the assembly of SMD and semiconductor chips, vacuum soldering or automatic optical inspections (AOI) for our customers from the renewable energy, automotive or consumer goods sectors.
Direct Copper Bonding Substrates (DCB, DDC, DBC or ceramic substrate)
Challenges
When manufacturing their products with DCB substrates, our customers often face several challenges. The ceramic substrates are highly sensitive and subject to the highest quality requirements, and they are produced in large quantities. In order to solve all challenges for our customers, we manufacture customized automation systems. We work hand in hand with our customers and produce automation solutions that are precisely tailored to the requirements of the product and the respective market.
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Quality and sensitive product
In order to ensure product quality, all process data must be known, which is why all production data is recorded and evaluated. Every step of a product in the process is recorded.
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Demand and cycle times
In order to meet high demand, our customers need to be able to produce quickly and in large quantities. The cycle times required for the production of a product play a major role here.
Solution
In order to connect the process steps (such as solder paste printing, the assembly of SMD and semiconductor chips, vacuum soldering or automatic optical inspections), stable and secure interfaces, precise and fast parts handling for transportation, transfer in process specific product carriers and a reliale traceability solution are required..
Traceability
In order to achieve a secure, stable and reliable connection of all process steps to the handling system, a MES is required. There are MES from various providers, such as the itac.Mom.suite (itac.MES.suite) from Itac Software AG, the MES from the Stiwa Group or the manufacturing information system (FIS) from Melecs Holding GmbH. We also offer our customers Pematech's own MES Lite. With MES systems, it is possible to map the entire production process, from order planning and material management through to quality assurance.
For example, the MES Lite from Pematech GmbH enables complete data management across the entire plant. The MES Lite assigns each workpiece and each goods carrier the process data through which it has already successfully passed. The carrier mapping not only records the paths of the workpieces and carriers, but also defines the further path of the workpiece or carrier. If, for example, a part has not passed a test in the production process, it is sorted out as NOK during the handling process.
The MES lite conveniently and reliably handles recipe management, variant management and order management. This makes it easy to process different product carriers, for example. Type-specific recipe preselection from external systems can also be implemented via our MES lite. For example, the recipe control of provided process modules is carried out via the Pematech software.
In the semiconductor sector, we also implement traceability under the SECS/GEM standard commonly used there.
Dexterity and fast cycle times
Careful and precise parts handling is required to ensure the quality of the products in the production process. Vacuum suction pads, for example, are used to achieve this. However, careful part handling must then go hand in hand with a fast cycle time.
Both requirements must be met equally for our customers. In the past, for example, we have used dynamic applications that can maintain very short cycle times using linear axes with direct drives. In order to achieve precise positioning of the parts in the product carriers, we use camera-supported positioning corrections so that the components can be precisely positioned in the µm range with process reliability.
